BGA Rework Station for repairs of motherboards ZM-R5830 ( SKU.1-PER0061 )

BGA Rework Station for repairs of motherboards ZM-R5830 ( SKU.1-PER0061 )

The ZM-R5830 is a BGA Rework Station ideal for repairing laptop motherboards, desktops, server boards, industrial PC boards, Playstation/XBox consoles, telecommunications boards, televisions and other large circuits based on BGA chips.

This is for one of ZHUOMAO's HIGH PREMIUM models, hence the white/cream color, which is exclusively available on the company's quality models.

The device includes a touch screen and a microprocessor for the welding process.
The display shows three temperature graphs with the actual values.
It is possible to analyze the process after its completion, even on the computer by connecting the USB port.
Each welding profile provides 8 temperature change steps.
The perfect temperature control system ensures successful welding.

With the high-definition touch screen, PCL control, it can save up to 50 profiles with password protection and modification function.
Temperature curves can be displayed on the screen.
Adjust and analyze the instantaneous temperature curves and temperature parameter according to your repair needs.
There are 3 independent heating positions from top to bottom: The first and second are hot air heaters, the third is IR quartz preheating device.

The upper heating element is adjustable on each surface and the lower one is height adjustable. The third surface heats the board, reducing pressure over a large area and lowering the temperature for proper soldering of the element.

Includes a high-precision, temperature-controlled K-type thermocouple that works with the PLC unit for precise temperature control ±3 °C. 
The alarm is activated after the completion of the desoldering and welding.

A powerful cross-flow fan automatically cools the PCB board after use to prevent PCB deformation by minimizing the time the heat is applied to the board. The powerful cross-flow fans quickly cool the PCB board, also the built-in vacuum suction cup helps you pick up the chip quickly and accurately.

The motherboard grips are with a V-groove which provides a quick and stable installation of the boards with a wide range of adjustments and can be processed for any board size.

Due to the high power, the device is adapted to work with large motherboards made in both lead- and lead-free soldering technology.

The hot air nozzle using magnetic replacement technology can be rotated freely at 360 ° and can be easily adjusted.
CE certificate, with emergency stop, automatic protection device and double overheating protection so that when the temperature gets out of control, the electrical circuit is automatically cut off.

Technical Specifications: Total consumption: 4500W
Top heater: 800W
Bottom heater 2nd heater: 1200W
3rd IR heater: 2400W
Input voltage: AC220V±10% 50/60Hz
BGA dimensions: 530x600x600 mm
Thermocouple (K Sensor) temperature control with accuracy ±3 °C
Board dimensions: Max 410x370mm / Min 20x20mm
Weight: 40kg

3 Year Warranty

Please make sure before ordering the product photo matches