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Controller IC Chip - MOSFET IRF8302MTRPBF 8302 IRF8302 IRF8302MPBF chip for laptop - Integrated Laptop Chip (Code 1-CHIP0491)

Controller IC Chip - MOSFET IRF8302MTRPBF 8302 IRF8302 IRF8302MPBF chip for laptop - Integrated Laptop Chip (Code 1-CHIP0491)
Controller IC Chip - MOSFET IRF8302MTRPBF 8302 IRF8302 IRF8302MPBF chip for laptop - Integrated Laptop Chip (Code 1-CHIP0491)
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  • Stock: In Stock
  • Brand: Unbranded
  • Model: 1-CHIP0491
  • SKU: 1-CHIP0491
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We send via DHL, UPS, USPS, FEDEX, Hellenic Greek Post, during the same day of the order placement. (Weekends are excluded).The average time of delivery for the United States is 13 to 18 days while for Europe is 5 to 7 days. Return Policy.

Our products are new and are shipped immediately. They have a 2 year warranty (except for batteries) and free shipping. Service line +302109247000 09:00-19:00 Mon-Fri. Our prices are without hidden charges and fees. We comply with the consumer rights directive 2011/83/EU. Any reference to the trademarks of the laptop manufacturers Toshiba, Lenovo, Acer, MSI, Asus, HP etc. is intended solely for the purpose of identifying the laptop manufacturer. Our Company and this website are not affiliated distributors with these manufacturers, the products offered for sale through our website are manufactured as high quality replacements by third party manufacturers. The products provided by our Company are not authentic. But they are worthy replacements and are sold for use in laptops of all manufacturers Toshiba Lenovo Acer MSI Asus HP etc.

Controller IC Chip - MOSFET IRF8302MTRPBF 8302 IRF8302 IRF8302MPBF chip for laptop- Integrated portable calculator chip(SKU.1-CHIP0491)

HEXFET Power MOSFET plus Schottky Diode

The IRF8302MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET® packaging to achievethe lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET® package is compatiblewith existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection solderingtechniques. Application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET® package allows dualsided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.The IRF8302MPbF balances industry leading on-state resistance while minimizing gate charge along with ultra low package inductance toreduce both conduction and switching losses. This part contains an integrated Schottky diode to reduce the Qrr of the body drain diode furtherreducing the losses in a Synchronous Buck circuit. The reduced losses make this product ideal for high frequency/high efficiency DC-DCconverters that power high current loads such as the latest generation of microprocessors. The IRF8302MPbF has been optimized forparameters that are critical in synchronous buck converter’s Sync FET sockets.

Please check the IC Number and match with your existing Product.

When you receive before using it.

Please confirm the chip you received is brand new as described,if you suspect the chip is not new or not as described. Please don't use it and contact us immediately.

Please make sure you have advanced soldering skill to solder the chips that you will order.

Once it has been used, no return will be accepted.