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Controller IC Chip - MOSFET IRF9395MTRPBF IRF9395 9395 IRF9395MPbF chip for laptop - Integrated Laptop Chip (Code 1-CHIP0493)

Controller IC Chip - MOSFET IRF9395MTRPBF IRF9395 9395 IRF9395MPbF chip for laptop - Integrated Laptop Chip (Code 1-CHIP0493)
Controller IC Chip - MOSFET IRF9395MTRPBF IRF9395 9395 IRF9395MPbF chip for laptop - Integrated Laptop Chip (Code 1-CHIP0493)
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Ex Tax: $8.59
  • Stock: In Stock
  • Brand: Unbranded
  • Model: 1-CHIP0493
  • SKU: 1-CHIP0493
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We send via DHL, UPS, USPS, FEDEX, Hellenic Greek Post, during the same day of the order placement. (Weekends are excluded).The average time of delivery for the United States is 13 to 18 days while for Europe is 5 to 7 days. Return Policy.

Our products are new and are shipped immediately. They have a 2 year warranty (except for batteries) and free shipping. Service line +302109247000 09:00-19:00 Mon-Fri. Our prices are without hidden charges and fees. We comply with the consumer rights directive 2011/83/EU. Any reference to the trademarks of the laptop manufacturers Toshiba, Lenovo, Acer, MSI, Asus, HP etc. is intended solely for the purpose of identifying the laptop manufacturer. Our Company and this website are not affiliated distributors with these manufacturers, the products offered for sale through our website are manufactured as high quality replacements by third party manufacturers. The products provided by our Company are not authentic. But they are worthy replacements and are sold for use in laptops of all manufacturers Toshiba Lenovo Acer MSI Asus HP etc.

Controller IC Chip - MOSFET IRF9395MTRPBF IRF9395 9395 IRF9395MPbF chip for laptop- Integrated portable calculator chip(SKU.1-CHIP0493)

DirectFET dual P-Channel Power MOSFET

The IRF9395MTRPbF combines the latest HEXFET® P-Channel Power MOSFET Silicon technology with the advanced DirectFETTM packagingto achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET package iscompatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convectionsoldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET packageallows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.

Please check the IC Number and match with your existing Product.

When you receive before using it.

Please confirm the chip you received is brand new as described,if you suspect the chip is not new or not as described. Please don't use it and contact us immediately.

Please make sure you have advanced soldering skill to solder the chips that you will order.

Once it has been used, no return will be accepted.